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Electronics Manufacturing Solutions
Thermal Management
Dispense Solutions for Thermal Management
As the world moves more towards electrification, the need to manufacture electronics is increasing. Consumer and industrial demand for greater functionality with a smaller product footprint make managing the thermal load critical to product life cycles and reliability.
Thermal interface materials help efficiently dissipate the heat generated in electronic parts. Accurate dispense of TIMs is important to the performance, quality and durability of electronic products.
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DOWSIL™ FC-2024 Battery Fire Protection Coating
To simplify battery fire protection, Dow Inc. developed a one component (1K) fire and blast resistant material, and then turned to Graco for an effective dispensing solution.
Comparing 1k Metering & Dispensing Systems
Shot size and flow rate, material properties, and manufacturing style are important when evaluating the correct metering system for single component sealants or adhesives.
Comparing 2k Meter Mix Dispense Systems
Chart compares advanced two-component meter mix dispense (MMD) systems, including PR-X, PD44, PR70, EFR, and HFR.
Controlling Excess Heat
Proper heat dissipation keeps electronic components running optimally.
Extreme Material Abrasiveness? Problem Solved with Elite
Some thermal interface materials (TIMs) are so abrasive, it’s like pumping diamond dust or liquid sandpaper. Explore why and how we developed Elite™, the longest-lasting pump construction for abrasive material dispense.
Thermal Management for EV Battery and Electronics Manufacturing
Whether it’s assembling electric vehicle (EV) batteries and electronic products, or miniaturizing printed circuit boards (PCBs), thermal management remains crucial to longevity, efficiency and safety.
Thermal Paste vs. Thermal Pads
Understanding the differences between thermal pads and dispensable thermal interface materials (TIMs) for dissipating heat in electronics can improve manufacturing efficiencies.
Thermal Interface Materials
Single and plural component dispensable thermal interface materials (TIMs) are widely used in thermal management applications.
Laird T-Putty 508
Laird T-Putty 508 is a thermal paste designed for heat dissipation in electronics applications.
Laird T-Putty 607
Laird T-Putty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind.
Therm-a-Gap Gel 30
THERM-A-GAP Gel 30 is a dispensable, very low-compression force thermal gap filler that provides superior long-term thermal stability and reliable performance.
Therm-a-Gap TC50
THERM-A-GAP™ TC50 is a high-performance, single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity.
LORD CoolTherm SC-1200
Since CoolTherm® SC 1200 thermally conductive silicone gap filler is highly abrasive, Parker LORD® asked Graco to find out how to dispense one million shots of the two component material without equipment failure.
LORD CoolTherm TC-2002
Parker Lord CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
